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Home » Technologies » Universal Ruggedized Computer Enclosure

Universal Ruggedized Computer Enclosure


High-Efficiency, Ruggedized Thermal Enclosure for High-Performance Computers


A military vehicle sits in the desert.
The technology in use during Project Convergence 2022 on the REO Argo J8 Site Characterization Platform. It spent over a month of operation in a harsh Californian desert.

High-performance desktop computers that can handle heavy software development are not designed for harsh environments. Current options include either ruggedized commercial off-the-shelf (COTS) computers or ruggedized computer enclosures, such as sealed pelican cases.

Ruggedized COTS computers typically lack heavy computing power and often have outdated hardware components by the time they are in use in the field. Additionally, they are also expensive and cannot be fitted with new motherboards or PCIe (Peripheral Component Interconnect Express) expansion cards.

Sealed pelican case-type enclosures often create a large form factor compared to purpose-built ruggedized computers. Additionally, these systems use air- and/or water-cooling solutions that require a lot of space and power, have limited shock dampening, and are not known to be able to withstand severely rugged or harsh environments.

This universal enclosure system was developed to allow the latest cutting-edge high-powered computing technology to be integrated into a compact and ruggedized formfactor for use in military robotic applications. It is easily integrated with common high-performance COTS desktop computers, printed circuit boards, and/or ATX (Advanced Technology eXtended) style motherboards.

The system enclosure can include: 

  • Integrated water cooling
  • A heat exchanger that cools the ambient circulating air
  • A positive pressure system that filters particulates, removes moisture from outside air, and provides ingress protection via constant pressure inside the system
  • A unique mounting method for PCIe expansion cards that reduces the overall size
  • Adjustable air suspension for extreme shock and vibration protection
  • An inner core that supports customization of accessories

The design enables every cubic millimeter of the hardware enclosure to act as an active component in the cooling process in addition to providing protection against a variety of environmental hazards such as extreme temperature, humid and damp conditions, shock and vibration, and electromagnetic interference.

This technological approach allows for a significant reduction in the footprint of the system, while providing cooling and other protection for computers and peripherals that can enhance the performance and lifespan.

Benefits:

  • Enhanced performance: More efficient heat dissipation leads to lower operating temperatures for internal components, which allows components to maintain higher performance levels for longer periods
  • Durable: Reduced operating temperature and limiting exposure to harsh environments can extend the lifespan of heat-sensitive components
  • Versatile: An adjustable suspension enables adapting the enclosure to differing environments and varying payloads
  • Compact: With coolant-filled wall chambers that eliminate the need for an external reservoir, the system requires 10 to 35 percent less space than a standard rack-mount computer case

Applications:

  • Military field operations
  • Industrial settings involving high levels of dust, vibration, or temperature extremes 
  • Robotics and unmanned electronics 
  • Outdoor applications requiring sensitive onsite computing
A translucent green enclosure with internal channels visible sits on a table.
This scale model was used to perfect the internal fluid handling elements as well as the manufacturing methods used to produce the first-generation prototype.
A gray rectangular device is shown with two black square protrusions on the end. Small round red and blue protrusions are on one edge with two small round buttons and a silver lock.
A computer-generated view of the first-generation prototype shows the transparent exterior of the enclosure.
Transparent walls house a small square heat exchanger.
This view of the first-generation prototype includes a heat exchanger mechanism contained within the walls of the enclosure along with internal plumbing and manifolds.
An infrared view of the interior of the enclosure shows purple tracings on a yellow background.
This interior view of the first-generation prototype shows the heat exchanger mechanism contained within the walls of the enclosure along with internal plumbing and manifolds. Fluid was pumped through the enclosure with computer hardware in the loop during a benchtop test.

Patents

  • US20240114653A1

Resources

  • ERDC article
  • ERDC article
  • DSIAC article

Technology Category

Electronics & Sensors, Protective Structures & Systems

Tags

Computer Heat Dissipation, Heat Exchanger, High-Performance Computers, Ruggedized Computer Enclosure, Ruggedized Computers

Affiliated Lab

Construction Engineering Research Laboratory

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