Universal Ruggedized Computer Enclosure
High-Efficiency, Ruggedized Thermal Enclosure for High-Performance, Upgradable Computing in Extreme Field Environments
This compact, additively manufactured, rugged computer enclosure features walls with 3D-printed lattice heat exchanger cores that create a functioning high-surface-area air-to-air heat exchanger with a complex lattice of channels for airflow. Heat pipes transfer heat from the hottest components (CPU, GPU, power supplies) into the structure’s side walls for removal. Fans mounted in the side walls pull ambient air from outside and push it through the lattice channels to dissipate the heat — the air from outside never mixes with the clean internal air around the electronics.
A built-in control unit monitors temperature, humidity, vibration, and more, adjusting fans and dehumidifiers as needed. If the system gets too hot, emergency cooling options kick in. Fine water misters spray the outside walls for quick evaporative cooling, or a Peltier device can actively cool the gallium loop on demand.
This system aims to enable high-performance, upgradeable COTS computing in harsh, vehicle, and field environments.
Ruggedized commercial off-the-shelf (COTS) computers often fail to meet high-performance needs in the field. They are costly, lack the latest hardware, cannot be upgraded with new motherboards or PCIe cards (peripheral component interconnect express), and are frequently outdated by the time they reach the field.
While sealed protective cases (e.g., Pelican cases) can ruggedize high-performance desktop computers, they are large, prone to heat buildup, and offer minimal shock protection. Cooling upgrades increase their size, power draw, and moisture risk, and power conversion requires bulky, noise-producing inverters.
There is a need for a compact, upgradeable, high-performance computing platform that survives shock, ingress, humidity, and high ambient temperatures.
Benefits:
- Compact, integrated design: The internal lattice walls operate as heat exchangers, achieving 10-35% space reduction compared to standard rackmount chassis.
- Universal compatibility and upgradability: Supports off-the-shelf ATX motherboards, dual GPUs, and CPUs, enabling easy upgrades.
- Component protection: Comprises a double-sealed interior, EMI shielding, and an adjustable air suspension system.
- Optimized thermal management: In addition to heat exchangers, additional emergency cooling options are available for extreme thermal conditions.
- Innovative manufacturing: Leverages direct metal laser sintering (DMLS) and additive manufacturing to create complex internal geometries.
- Efficient power system: DC-DC power supply eliminates bulky inverters, reducing power conversion losses, system noise, and overall power requirements.
Applications:
- Military and defense
- Construction/heavy equipment
- Robotics
- Field laboratories and emergency response
Patents
- 18896887 (Search patent)
- 17957230 (Search patent)
- 18479017 (Search patent)